%0 Journal Article %1 mei2021effect %A Mei, J. %A Haug, R. %A Grözinger, T. %A Zimmermann, André %D 2021 %I Elsevier %J Microelectronics reliability %K %N July %P 114151 %R 10.1016/j.microrel.2021.114151 %T Effect of high current pulses on solder interfacial reaction and interconnect reliability %V 122

@article{mei2021effect, added-at = {2023-08-31T16:44:26.000+0200}, affiliation = {Mei, J (Corresponding Author), Robert Bosch GmbH, Robert Bosch Str 2, D-71701 Schwieberdingen, Germany. Mei, J.; Haug, R., Robert Bosch GmbH, Robert Bosch Str 2, D-71701 Schwieberdingen, Germany. Groezinger, T.; Zimmermann, A., Hahn Schickard, Allmandring 9B, D-70569 Stuttgart, Germany. Zimmermann, A., Univ Stuttgart, Inst Micro Integrat IFM, Allmandring 9B, D-70569 Stuttgart, Germany.}, author = {Mei, J. and Haug, R. and Grözinger, T. and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2ec485bc8712827dd58508b086f921a88/puma-wartung}, doi = {10.1016/j.microrel.2021.114151}, interhash = {13b7d6defa8ddbf3cc3da4a21c289e87}, intrahash = {ec485bc8712827dd58508b086f921a88}, issn = {0026-2714}, journal = {Microelectronics reliability}, keywords = {}, language = {eng}, number = {July}, pages = 114151, publisher = {Elsevier}, research-areas = {Engineering; Science & Technology - Other Topics; Physics}, timestamp = {2023-08-31T14:44:26.000+0200}, title = {Effect of high current pulses on solder interfacial reaction and interconnect reliability}, unique-id = {ISI:000659230300005}, volume = 122, year = 2021 }