%0 Journal Article %1 journals/mr/JiangYZXW08 %A Jiang, Li %A Yang, Keling %A Zhou, Jiemin %A Xiang, Ke %A Wang, Wenjie %D 2008 %J Microelectronics Reliability %K dblp %N 3 %P 438-444 %T Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement. %U http://dblp.uni-trier.de/db/journals/mr/mr48.html#JiangYZXW08 %V 48

@article{journals/mr/JiangYZXW08, added-at = {2010-09-27T00:00:00.000+0200}, author = {Jiang, Li and Yang, Keling and Zhou, Jiemin and Xiang, Ke and Wang, Wenjie}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2df04ae891963be695226488ea221d8dc/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2007.08.004}, interhash = {2809becf974f7bb70ba52b8e97937941}, intrahash = {df04ae891963be695226488ea221d8dc}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 3, pages = {438-444}, timestamp = {2016-02-02T01:59:43.000+0100}, title = {Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr48.html#JiangYZXW08}, volume = 48, year = 2008 }