Publications

S. T. Turner, P. Pingel, R. Steyrleuthner, E. J. W. Crossland, S. Ludwigs, and D. Neher. Quantitative Analysis of Bulk Heterojunction Films Using Linear Absorption Spectroscopy and Solar Cell Performance. Advanced Functional Materials, (21)24:4640, John Wiley & Sons, Ltd, December 2011. [PUMA: Organic absorption cells electronics mobility morphology solar spectroscopy] URL

V. Radisic, K. M. K. H. Leong, X. Mei, S. Sarkozy, W. Yoshida, P. Liu, J. Uyeda, R. Lai, and W. R. Deal. A 50 mW 220 GHz power amplifier module. 2010 IEEE MTT-S International Microwave Symposium, 45-48, May 2010. [PUMA: 207 220 230 50 GHz GHz;Power GHz;frequency MMIC;coplanar Waveguide;Module amplifier amplifier;HEMT;Coplanar amplifier;eight-way amplifiers;Power amplifiers;power circuits;Bandwidth;Frequency;MMICs;Indium combiners;power combining;amplifier coplanar coupler;Dolph-Chebychev electron faults;MMIC;Power generation;Coplanar mW;frequency mobility module;solid-state on-chip phosphide;HEMTs;Circuit power state technology;HEMT to transformer;power transistors;power transistors;tandem waveguide waveguides;Solid waveguides;high]

I. Dan, G. Ducournau, S. Hisatake, P. Szriftgiser, R. Braun, and I. Kallfass. A Terahertz Wireless Communication Link Using a Superheterodyne Approach. IEEE Transactions on Terahertz Science and Technology, (10)1:32-43, January 2020. [PUMA: (THz) 10.2 100 300.0 GHz;bit Gbit/s;InGaAs;Complex Gbit/s;bit MIMIC;gallium amplitude analogue-digital applications;wireless arbitrary arsenide;HEMT binary channels;terahertz circuits;IEEE circuits;InGaAs circuits;modems;quadrature circuits;multichannel communication communication;high communications;wireless components;monolithic compounds;millimetre configuration;receiver;fast conversion;binary converters;frequency converters;multichannel data data;transmission distances;complex effect electron frequency;baseband generator;carrier generators;wireless high integrated link;low link;pseudorandom link;terahertz links;radio metamorphic millimeter mobility modulated modulation;millimeter modulation;radio monolithic point-to-point range;all-electronic rate rates;64-QAM;THz receivers;terahertz semiconductors;indium sequences;analog-to-digital sequences;field sequences;superheterodyne signal;digital signals;16-QAM;32-QAM;baseband standard;wireless standards;III-V technology;IEEE terahertz transistor transmission;channel transmission;radio transmissions;modems;superheterodyne transmitters;random wave waveform waves;waveform wireless]

S. Koch, M. Guthoerl, I. Kallfass, A. Leuther, and S. Saito. A 120-145 GHz Heterodyne Receiver Chipset Utilizing the 140 GHz Atmospheric Window for Passive Millimeter-Wave Imaging Applications. Solid-State Circuits, IEEE Journal of, (45)10:1961--1967, 2010. [PUMA: 100 120 145 31 35 37 GHz GHz;frequency GHz;grounded HEMT circuit;mm circuits;MIMIC;coplanar controlled coplanar detection;millimetre electron imaging;power imaging;radio integrated mW;voltage mm mobility monolithic nm;HEMT oscillator;wavelength oscillators; receiver;high receivers;chipset receivers;voltage-controlled technology;MIMIC;VCO;atmospheric to transistor;millimeter utilization;frequency wave waveguide;heterodyne waveguides;heterodyne windows;broadband]

B. Aja, K. Schuster, F. Schafer, J.D. Gallego, S. Chartier, M. Seelmann-Eggebert, I. Kallfass, A. Leuther, H. Massler, M. Schlechtweg, C. Diez, I. Lopez-Fernandez, S. Lenz, and S. Turk. Cryogenic Low-Noise mHEMT-Based MMIC Amplifiers for 4 - 12 GHz Band. Microwave and Wireless Components Letters, IEEE, (21)11:613--615, 2011. [PUMA: 100 11.6 12 22 26 4 41 8.1 GHz GHz;gain InAlAs-InGaAs;MMIC K;III-V K;temperature MMIC amplifiers; amplifiers;aluminium amplifiers;coplanar amplifiers;cryogenic arsenide;high chips;amplifier circuit;power circuits;broadband compounds;cryogenic compounds;low dB;gain dB;metamorphic electron electronics;gallium high integrated low-noise mHEMT-based mW;power mW;size microwave mobility nm;temperature noise semiconductors;MMIC technology;cryogenic temperature;frequency to transistor;monolithic transistors;indium very]

U. Lewark, A. Tessmann, H. Massler, A. Leuther, and I. Kallfass. Active frequency multiplier-by-nine \MMIC\ for millimeter-wave signal generation. in Proc. German Microwave Conference (GeMIC), Darmstadt, 1--4, 2011. [PUMA: 100 87 99 Fraunhofer GHz GHz;millimeter-wave HEMT IAF MMIC;buffer amplifier;frequency convertors;phase electron frequency generation;phase-noise generators; measurements;size metamorphic mobility multiplier-by-nine multipliers;high nm;MMIC;amplifiers;frequency noise;signal signal technology;X-band;active to transistors;millimetre wave]

I. Kallfass, P. Pahl, H. Massler, A. Leuther, A. Tessmann, S. Koch, and T. Zwick. A 200 GHz Monolithic Integrated Power Amplifier in Metamorphic HEMT Technology. Microwave and Wireless Components Letters, IEEE, (19)6:410--412, June 2009. [PUMA: 100 186 212 GHz GHz, HEMT amplifier, amplifiers amplifierscommunication electron frequency high high-resolution imaging integrated metamorphic millimeter-wave millimetre mobility monolithic nm,MMIC power radar, size systems, technology, to transistor transistors, wave]

A. Tessmann, A. Leuther, V. Hurm, I. Kallfass, H. Massler, M. Kuri, M. Riessle, M. Zink, R. Loesch, M. Seelmann-Eggebert, M. Schlechtweg, and O. Ambacher. Metamorphic HEMT MMICs and Modules Operating Between 300 and 500 GHz. Solid-State Circuits, IEEE Journal of, (46)10:2193--2202, 2011. [PUMA: 20 220 35 50 500 GCPW;GaAs;InAlAs-InGaAs;S-MMIC GHz GHz;grounded HEMT MMIC MMIC;cascode amplifier amplifiers;submillimetre arsenide;indium circuit circuit;class-B circuit;frequency circuits; circuits;III-V circuits;waveguide-to-microstrip communication compounds;coplanar compounds;submillimetre coplanar doubler frequency high-electron integrated mobility module;amplifier monolithic multipliers;gallium mum;submillimeter-wave nm;size semiconductors;aluminium sensors;size systems;metamorphic technology;metamorphic technology;monolithically to topology;grounded transistor transitions;HEMT transitions;next-generation wave waveguide waveguide;high-data-rate waveguides;frequency wireless]

Alexander Probst, Martin Siegel, Martin Braun, and Stefan Tenbohlen. Impacts of Electric Mobility on Distribution Grids and Possible Solution through Load Management. 2011. [PUMA: Distribution Electric Grids Load Management Mobility Possible Solution] URL

Alexander C. Probst, Martin Braun, Jurgen Backes, and Stefan Tenbohlen. Probabilistic analysis of voltage bands stressed by electric mobility. ISGT Europe, 1-8, IEEE, 2011. [PUMA: Probabilistic analysis bands electric mobility voltage] URL