Author of the publication

Temperature-Aware Memory Mapping and Active Cooling of Neural Processing Units

, , , , , and . 2023 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), page 1-6. Piscataway, NJ, IEEE, (2023)
DOI: 10.1109/ISLPED58423.2023.10244458

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Kattan, Hammam
add a person with the name Kattan, Hammam
 

Other publications of authors with the same name

On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array, , , and . IEEE micro, 41 (4): 67-73 (2021)Impact of NCFET Technology on Eliminating the Cooling Cost and Boosting the Efficiency of Google TPU, , , , , , and . IEEE transactions on computers, 71 (4): 906-918 (2022)Advanced Thermal Management using Approximate Computing and On-Chip Thermoelectric Cooling, and . 2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI), Piscataway, IEEE, (2022)Temperature-Aware Memory Mapping and Active Cooling of Neural Processing Units, , , , , and . 2023 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), page 1-6. Piscataway, NJ, IEEE, (2023)Longevity of Commodity DRAMs in Harsh Environments Through Thermoelectric Cooling, , , , , and . IEEE Access, (2021)NPU Thermal Management, , , , , and . IEEE transactions on computer-aided design of integrated circuits and systems, 39 (11): 3842-3855 (2020)