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Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.

, , , , , , and . Microelectronics Reliability, 47 (2-3): 187-195 (2007)

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Characterization of ionic permeability and water vapor transmission rate of polymers used for implantable electronics., , , and . EMBC, page 6561-6564. IEEE, (2014)Creep of thermally aged SnAgCu-solder joints., and . Microelectronics Reliability, 47 (2-3): 223-232 (2007)Electronics Process Technology - Production Modelling, Simulation and Optimisation., , , , , , and . Springer, (2006)Fodel microresistors-processing and basic electrical properties., , , and . Microelectronics Reliability, 43 (3): 377-383 (2003)Study of temperature dependent properties of organic substrate materials., and . Microelectronics Reliability, 48 (6): 876-880 (2008)Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders., and . Microelectronics Reliability, 44 (12): 1923-1931 (2004)The effect of downscaling the dimensions of solder interconnects on their creep properties., , , and . Microelectronics Reliability, 48 (6): 843-850 (2008)Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors., , , , , , , and . Microelectronics Reliability, 41 (5): 669-676 (2001)Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept., , , , , , and . Microelectronics Reliability, 47 (2-3): 187-195 (2007)