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Characterization of the Proximity Effect From Tungsten TSVs on 130-nm CMOS Devices in 3-D ICs., and . IEEE Trans. VLSI Syst., 22 (9): 2025-2029 (2014)8.1 nJ/b 2.4 GHz Short-Range Communication Receiver in 65 nm CMOS., and . IEEE Trans. on Circuits and Systems, 62-I (7): 1854-1862 (2015)Analysis and Design of an Ultra-Low-Power Bluetooth Low-Energy Transmitter With Ring Oscillator-Based ADPLL and 4 $\times$ Frequency Edge Combiner., , , , , , and . J. Solid-State Circuits, 54 (5): 1339-1350 (2019)Back-Channel Wireless Communication Embedded in WiFi-Compliant OFDM Packets., and . IEEE Journal on Selected Areas in Communications, 34 (12): 3181-3194 (2016)Direct Conversion Pulsed UWB Transceiver Architecture, , , , , and . CoRR, (2007)Circuit and System Designs of Ultra-Low Power Sensor Nodes With Illustration in a Miniaturized GNSS Logger for Position Tracking: Part I - Analog Circuit Techniques., , , , , , , , , and 5 other author(s). IEEE Trans. on Circuits and Systems, 64-I (9): 2237-2249 (2017)A 10.6mm3 fully-integrated, wireless sensor node with 8GHz UWB transmitter., , , , , , and . VLSIC, page 202-. IEEE, (2015)Wireless wafer-level testing of integrated circuits via capacitively-coupled channels., , and . DDECS, page 99-104. IEEE Computer Society, (2011)A 470µW -92.5dBm OOK/FSK Receiver for IEEE 802.11 WiFi LP-WUR., , and . ESSCIRC, page 302-305. IEEE, (2018)A Low Power Bluetooth Low-Energy Transmitter with a 10.5nJ Startup-Energy Crystal Oscillator., , , , , , and . ESSCIRC, page 377-380. IEEE, (2019)