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Accuracy and boundary condition independence of Cauer RC ladder compact thermal models., , , and . Microelectronics Journal, 44 (7): 619-622 (2013)High-voltage high input impedance unity-gain voltage buffer., and . Microelectronics Journal, 44 (7): 576-585 (2013)Polyhedral Source-to-Source Compiler., , , and . MIXDES, page 458-463. IEEE, (2016)Impact of floorplanning and thermal vias placement on temperature in 2D and 3D processors., , , and . Microelectronics Journal, (2016)Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions., , , , , , and . Microelectronics Reliability, (2017)Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs., and . Microelectronics Reliability, (2018)Extended Sensor Reliability Evaluation Method in multi-sensor control systems., , , , and . Microelectronics Reliability, 55 (3-4): 671-678 (2015)Application of olfactory event-related potentials for diagnosis of neurodegenerative diseases., , and . MIXDES, page 525-528. IEEE, (2013)MTCA.4 LLRF system for the European XFEL., , , , , , , , , and 29 other author(s). MIXDES, page 109-112. IEEE, (2013)The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties., , , and . MIXDES, page 93-96. IEEE, (2014)