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Cloud computing for integrated stochastic groundwater uncertainty analysis.

Y. Liu, A. Sun, K. Nelson, and W. Hipke. Int. J. Digital Earth, 6 (4): 313-337 (2013)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Di Liu University of Stuttgart

Data for: The silicon vacancy centers in SiC: determination of intrinsic spin dynamics for integrated quantum photonicsD. Liu. Dataset, (2024)Related to: Di Liu, Florian Kaiser, Vladislav Bushmakin, Erik Hesselmeier, Timo Steidl, Takeshi Ohshima, Nguyen Tien Son, Jawad Ul-Hassan, Öney O. Soykal, Jörg Wrachtrup (2023). The silicon vacancy centers in SiC: determination of intrinsic spin dynamics for integrated quantum photonics. arXiv preprint. arXiv: 2307.13648.

Dexing Liu University of Stuttgart

apl. Prof. Dr. Yong Cui University of Stuttgart

Jan Liu University of Stuttgart

M.Sc. Zhuoran Liu University of Stuttgart

Other publications of authors with the same name

Classification of incomplete data based on belief functions and K-nearest neighbors.Z. Liu, Y. Liu, J. Dezert, and Q. Pan. Knowl.-Based Syst., (2015)Multi-period modeling of two-way price commitment under price-dependent demand.Y. Liu, F. Qin, M. Fry, and A. Raturi. European Journal of Operational Research, 221 (3): 546-556 (2012)Moduli Set Selection and Cost Estimation for RNS-Based FIR Filter and Filter Bank Design.Y. Liu, and E. Lai. Design Autom. for Emb. Sys., 9 (2): 123-139 (2004)Wireless Video Transmission Scheme Based on Virtual MIMO and Network Coding Technology.Y. Liu, L. Sun, and S. Yang. JNW, 6 (1): 88-95 (2011)Study of High-Accurate Frequency Estimation in 60GHz Wireless Communication System.K. Chen, Y. Zhao, H. Wu, Q. Wang, Y. Liu, R. Tang, B. Liu, and L. Ge. JCM, 10 (7): 474-479 (2015)On fluid queueing systems with strict priority.Y. Liu, and W. Gong. IEEE Trans. Automat. Contr., 48 (12): 2079-2088 (2003)3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package.Y. Liu, L. Liang, S. Irving, and T. Luk. Microelectronics Reliability, 48 (6): 811-824 (2008)Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance.L. Xu, Y. Liu, and S. Liu. Microelectronics Reliability, 54 (12): 2824-2835 (2014)Trends of power semiconductor wafer level packaging.Y. Liu. Microelectronics Reliability, 50 (4): 514-521 (2010)Pricing in multiservice loss networks: static pricing, asymptotic optimality, and demand substitution effects.I. Paschalidis, and Y. Liu. IEEE/ACM Trans. Netw., 10 (3): 425-438 (2002)