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Disambiguation of "Swinnen, Bart"

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Impact of 3D design choices on manufacturing cost.

, , , , and . 3DIC, page 1-5. IEEE, (2009)

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Rahul Barthwal University of Stuttgart

Lukas Bartholomäus University of Stuttgart

Dr. rer. nat. Simon Barth University of Stuttgart

Aneesh Barthakur University of Stuttgart

Christian Bartsch University of Stuttgart

 

Other publications of authors with the same name

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding., , , , , , , , , and 6 other author(s). 3DIC, page 1-4. IEEE, (2011)Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures., , , , , and . Microelectronics Reliability, 48 (8-9): 1517-1520 (2008)Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads., , and . Microelectronics Reliability, 46 (8): 1315-1325 (2006)Impact of 3D design choices on manufacturing cost., , , , and . 3DIC, page 1-5. IEEE, (2009)In-line metrology and inspection for process control during 3D stacking of IC's., , , , , , , and . 3DIC, page 1-4. IEEE, (2011)300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications., , , , , , , , , and . 3DIC, page 1-4. IEEE, (2010)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)., , , , , , , , , and 3 other author(s). 3DIC, page 1-5. IEEE, (2009)