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Disambiguation of "Dinakarrao, Sai Manoj Pudukotai"

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Reinforcement learning based self-adaptive voltage-swing adjustment of 2.5D I/Os for many-core microprocessor and memory communication.

, , , , and . ICCAD, page 224-229. IEEE, (2014)

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Manoj Paneru University of Stuttgart

Simon Sailer University of Stuttgart

Bhupender Kumar Saini University of Stuttgart

Harnoor Saini University of Stuttgart

Basudeb Sain University of Stuttgart

 

Other publications of authors with the same name

Weighted Quantization-Regularization in DNNs for Weight Memory Minimization Toward HW Implementation., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 37 (11): 2929-2939 (2018)Zonotope-based nonlinear model order reduction for fast performance bound analysis of analog circuits with multiple-interval-valued parameter variations., , and . DATE, page 1-6. European Design and Automation Association, (2014)A robustness optimization of SRAM dynamic stability by sensitivity-based reachability analysis., , and . ASP-DAC, page 461-466. IEEE, (2014)Cyber-physical management for heterogeneously integrated 3D thousand-core on-chip microprocessor., and . ISCAS, page 533-536. IEEE, (2013)Unified Testing and Security Framework for Wireless Network-on-Chip Enabled Multi-Core Chips., , , and . ACM Trans. Embedded Comput. Syst., 18 (5s): 75:1-75:20 (2019)Pyramid: Machine Learning Framework to Estimate the Optimal Timing and Resource Usage of a High-Level Synthesis Design., , , , , , , , and . CoRR, (2019)Advances and throwbacks in hardware-assisted security: special session., , , , , , , , , and 1 other author(s). CASES, page 15:1-15:10. ACM, (2018)Lightweight Node-level Malware Detection and Network-level Malware Confinement in IoT Networks., , , , , and . DATE, page 776-781. IEEE, (2019)A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os., , , , , and . DATE, page 1-4. European Design and Automation Association, (2014)Peak power reduction and workload balancing by space-time multiplexing based demand-supply matching for 3D thousand-core microprocessor., , and . DAC, page 175:1-175:6. ACM, (2013)