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Disambiguation of "Lee, Hyein"

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Vertical M1 Routing-Aware Detailed Placement for Congestion and Wirelength Reduction in Sub-10nm Nodes.

, , , , , and . DAC, page 51:1-51:6. ACM, (2017)

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Moosung Lee University of Stuttgart

Dongwon Lee University of Stuttgart

Junghwa Lee University of Stuttgart

Yoonhee Lee University of Stuttgart

Hyosang Lee University of Stuttgart

 

Other publications of authors with the same name

Learning-based approximation of interconnect delay and slew in signoff timing tools., , , , and . SLIP, page 1-8. IEEE, (2013)Horizontal benchmark extension for improved assessment of physical CAD research., , and . ACM Great Lakes Symposium on VLSI, page 27-32. ACM, (2014)A Determination Scheme for Quasi-Identifiers Using Uniqueness and Influence for De-Identification of Clinical Data., , , , , and . CoRR, (2018)VirtualComponent: A Mixed-Reality Tool for Designing and Tuning Breadboarded Circuits., , , , and . CHI, page 177. ACM, (2019)HapCube: A Wearable Tactile Device to Provide Tangential and Normal Pseudo-Force Feedback on a Fingertip., , , and . CHI, page 501. ACM, (2018)Performance- and energy-aware optimization of BEOL interconnect stack geometry in advanced technology nodes., , , and . ISQED, page 104-110. IEEE, (2017)Evaluation of BEOL design rule impacts using an optimal ILP-based detailed router., , and . DAC, page 68:1-68:6. ACM, (2015)Pulse Width Allocation and Clock Skew Scheduling: Optimizing Sequential Circuits Based on Pulsed Latches., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 29 (3): 355-366 (2010)High-performance gate sizing with a signoff timer., , , , and . ICCAD, page 450-457. IEEE, (2013)HapCube: A Fingertip-Sized Tactile Device Providing 2+1 Dimensional Pseudo-Force Feedback., , , and . CHI Extended Abstracts, ACM, (2018)