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A Snake Robot Using Shape Memory Alloys.

C. Liu, and W. Liao. ROBIO, page 601-605. IEEE, (2004)

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Di Liu University of Stuttgart

Data for: The silicon vacancy centers in SiC: determination of intrinsic spin dynamics for integrated quantum photonicsD. Liu. Dataset, (2024)Related to: Di Liu, Florian Kaiser, Vladislav Bushmakin, Erik Hesselmeier, Timo Steidl, Takeshi Ohshima, Nguyen Tien Son, Jawad Ul-Hassan, Öney O. Soykal, Jörg Wrachtrup (2023). The silicon vacancy centers in SiC: determination of intrinsic spin dynamics for integrated quantum photonics. arXiv preprint. arXiv: 2307.13648.

Dexing Liu University of Stuttgart

Jan Liu University of Stuttgart

M.Sc. Zhuoran Liu University of Stuttgart

Yanchao Liu University of Stuttgart

Other publications of authors with the same name

Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package.C. Yang, W. Liu, and C. Liu. Microelectronics Reliability, 52 (5): 855-860 (2012)Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces.H. Tseng, C. Lu, Y. Hsiao, P. Liao, Y. Chuang, T. Chung, and C. Liu. Microelectronics Reliability, 50 (8): 1159-1162 (2010)Sortability of vector partitions.F. Hwang, J. Lee, Y. Liu, and U. Rothblum. Discrete Mathematics, 263 (1-3): 129-142 (2003)A Snake Robot Using Shape Memory Alloys.C. Liu, and W. Liao. ROBIO, page 601-605. IEEE, (2004)A New Family of Wavelength-Time Optical CDMA Codes Utilizing Programmable Arrayed Waveguide Gratings.W. Kwong, G. chang Yang, and Y. Liu. IEEE Journal on Selected Areas in Communications, 23 (8): 1564-1571 (2005)Scheduling Open Shops with Unit Execution Times to Minimize Functions of Due Dates.C. Liu, and R. Bulfin. Operations Research, 36 (4): 553-559 (1988)A Temperature Prediction Method of Valve-regulated Lead-acid Battery.T. Lai, K. Tsang, Y. Liu, and L. Lai. ISIE, page 2467-2470. IEEE, (2019)A Complex Evaluation and Optimization Approach for Oxygen-Enriched Combustion Characteristics of Blended Fuels Based on Response Surface Methodology.Y. Liu, H. Zhang, Z. Luo, S. Qing, A. Zhang, and S. Yang. Complex., (2020)Effects of Al on the failure mechanism of the Sn-Ag-Zn eutectic solder.C. Wei, Y. Liu, L. Yu, H. Chen, and X. Wang. Microelectronics Reliability, 50 (8): 1142-1145 (2010)Identifying the Modal Parameters of a Structure from Ambient Vibration Data via the Stationary Wavelet Packet.W. Su, C. Huang, C. Chen, C. Liu, H. Huang, and Q. Le. Comp.-Aided Civil and Infrastruct. Engineering, 29 (10): 738-757 (2014)