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Comparison of different flex materials in high density flip chip on flex applications.

P. Palm, J. Määttänen, Y. Maquillé, A. Picault, J. Vanfleteren, and B. Vandecasteele. Microelectronics Reliability, 43 (3): 445-451 (2003)

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Tim Janz University of Stuttgart

PD Dr. phil. Frank Janle University of Stuttgart

Benedikt Janny

Isabel Janowsky University of Stuttgart

Hon. -Prof. Dr. Martin Jansen University of Stuttgart

Other publications of authors with the same name

Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability.M. Jablonski, R. Lucchini, F. Bossuyt, T. Vervust, J. Vanfleteren, J. DeVries, P. Vena, and M. Gonzalez. Microelectronics Reliability, 55 (1): 143-154 (2015)Design and implementation of flexible and stretchable systems.M. Gonzalez, B. Vandevelde, W. Christiaens, Y. Hsu, F. Iker, F. Bossuyt, J. Vanfleteren, O. van der Sluis, and P. Timmermans. Microelectronics Reliability, 51 (6): 1069-1076 (2011)Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers.A. Jahanshahi, P. Salvo, and J. Vanfleteren. EMBC, page 6007-6010. IEEE, (2012)Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor.M. Jablonski, F. Bossuyt, J. Vanfleteren, T. Vervust, and H. de Vries. Microelectronics Reliability, 53 (7): 956-963 (2013)Feasibility Study and Performance Analysis of a Gyroless Orientation Tracker.B. Huyghe, P. Salvo, J. Doutreloigne, and J. Vanfleteren. IEEE Trans. Instrumentation and Measurement, 61 (8): 2274-2282 (2012)Design Automation of Meandered Interconnects for Stretchable Circuits.B. Plovie, J. Vanfleteren, T. Vervust, A. Quintero, and F. Bossuyt. IEEE Trans. on CAD of Integrated Circuits and Systems, 38 (9): 1648-1660 (2019)Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles.P. Veske, F. Bossuyt, and J. Vanfleteren. Sensors, 22 (1): 156 (2022)Improved passive-matrix multiplexability with a modular display and UTCP technology.P. Bauwens, A. Monté, W. Christiaens, J. Doutreloigne, and J. Vanfleteren. Displays, 30 (2): 71-76 (2009)In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas.D. Kurup, M. Scarpello, G. Vermeeren, W. Joseph, K. Dhaenens, F. Axisa, L. Martens, D. Ginste, H. Rogier, and J. Vanfleteren. EURASIP J. Wireless Comm. and Networking, (2011)Flexible and stretchable electronics for wearable healthcare.J. van den Brand, M. de Kok, A. Sridhar, M. Cauwe, R. Verplancke, F. Bossuyt, J. de Baets, and J. Vanfleteren. ESSDERC, page 206-209. IEEE, (2014)

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Disambiguation of "Vanfleteren, Jan"

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Comparison of different flex materials in high density flip chip on flex applications.

Please choose a person to relate this publication to

Tim Janz University of Stuttgart

PD Dr. phil. Frank Janle University of Stuttgart

Benedikt Janny

Isabel Janowsky University of Stuttgart

Hon. -Prof. Dr. Martin Jansen University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Vanfleteren, Jan"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Comparison of different flex materials in high density flip chip on flex applications.

Please choose a person to relate this publication to

Tim Janz University of Stuttgart

PD Dr. phil. Frank Janle University of Stuttgart

Benedikt Janny

Isabel Janowsky University of Stuttgart

Hon. -Prof. Dr. Martin Jansen University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Comparison of different flex materials in high density flip chip on flex applications.