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Through-Silicon Via-Based Capacitor and Its Application in LDO Regulator Design.

, , , , , , and . IEEE Trans. VLSI Syst., 27 (8): 1947-1951 (2019)

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A Low Distortion CMOS Bootstrapped Switch., , and . PACCS, page 261-264. IEEE Computer Society, (2009)Simultaneous Wireless Strain Sensing and Energy Harvesting From Multiple Piezo-Patches for Structural Health Monitoring Applications., , , , and . IEEE Trans. Ind. Electron., 66 (10): 8235-8243 (2019)Through-Silicon Via-Based Capacitor and Its Application in LDO Regulator Design., , , , , , and . IEEE Trans. VLSI Syst., 27 (8): 1947-1951 (2019)A Transient-Enhanced Digital Low-Dropout Regulator with Bisection Method Tuning., , , , and . APCCAS, page 50-52. IEEE, (2018)A Novel Low Power Three-Input OR/XNOR Gate Design., , , and . J. Low Power Electronics, 10 (3): 342-346 (2014)Stability analysis for coupled multilayer graphene nanoribbon interconnects., , , , and . Microelectronics Journal, (2016)Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits., , and . Microelectronics Journal, 43 (2): 128-133 (2012)System level performance evaluation of three-dimensional integrated circuit., , and . ASICON, page 694-697. IEEE, (2011)Loess Magnetic Susceptibility in Central Asia and its Paleoclimatic Significance., , , , , , and . IGARSS (2), page 1227-1230. IEEE, (2008)Study on crosstalk characteristic of carbon nanotube through silicon vias for three dimensional integration., , and . Microelectronics Journal, 46 (7): 572-580 (2015)