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Managing substrate and interconnect noise from high performance repeater insertion in a mixed-signal environment.

, , , , and . ISCAS (1), page 612-615. IEEE, (2005)

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A high precision CMOS current mirror/divider., and . ISCAS (2), page 314-317. IEEE, (1999)Managing substrate and interconnect noise from high performance repeater insertion in a mixed-signal environment., , , , and . ISCAS (1), page 612-615. IEEE, (2005)Guest Editorial Special Section on System-on-Chip Integration: Challenges and Implications., and . IEEE Trans. VLSI Syst., 15 (10): 1065-1066 (2007)Efficient placement of distributed on-chip decoupling capacitors in nanoscale ICs., , , and . ICCAD, page 811-816. IEEE Computer Society, (2007)Accurate Simulation Environment for Signal Isolation in Mixed-Signal Design., , , , and . SoCC, page 105-108. IEEE, (2005)Signal integrity implications of inductor-to-circuit proximity., , , , , , and . SoCC, page 69-72. IEEE, (2004)Worst Case Power/Ground Noise Estimation Using an Equivalent Transition Time for Resonance., , , and . IEEE Trans. on Circuits and Systems, 56-I (5): 997-1004 (2009)An adaptive circuits concept to address mismatch in analog circuits., and . ISCAS (1), page 885-888. IEEE, (2004)A low-voltage low-noise digital buffer system., , and . ISCAS (4), page 181-184. IEEE, (2002)Efficient Distributed On-Chip Decoupling Capacitors for Nanoscale ICs., , , and . IEEE Trans. VLSI Syst., 16 (12): 1717-1721 (2008)