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Thermally Aware Design., , and . Foundations and Trends in Electronic Design Automation, 2 (3): 255-370 (2008)Sequencing problem for a hull mixed-model assembly line considering manufacturing complexity., , and . Journal of Intelligent and Fuzzy Systems, 30 (3): 1461-1473 (2016)Automated module assignment in stacked-Vdd designs for high-efficiency power delivery., and . JETC, 4 (4): 18:1-18:20 (2008)High-Efficiency Green Function-Based Thermal Simulation Algorithms., and . IEEE Trans. on CAD of Integrated Circuits and Systems, 26 (9): 1661-1675 (2007)Optimal Response to Burstable Billing under Demand Uncertainty., , , , and . CoRR, (2016)Temperature-aware routing in 3D ICs., , and . ASP-DAC, page 309-314. IEEE, (2006)A high efficiency full-chip thermal simulation algorithm., and . ICCAD, page 635-638. IEEE Computer Society, (2005)A fixed-die floorplanning algorithm using an analytical approach., , and . ASP-DAC, page 771-776. IEEE, (2006)Ethernet-Based Computer Monitoring the Roof Abscission Layer With Experts Forecasting System., , , and . FSKD (5), page 622-626. IEEE Computer Society, (2008)978-0-7695-3305-6.Molecular simulation assisted identification of Ca2+ binding residues in TMEM16A., , , , , , , , , and 1 other author(s). Journal of Computer-Aided Molecular Design, 29 (11): 1035-1043 (2015)