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A 5 Million Frames Per Second 3D Stacked Image Sensor With In-Pixel Digital Storage., , , , , , and . ESSCIRC, page 62-65. IEEE, (2018)A novel 0.5GHz real time asynchronous photon detection and counting technique: ROIC design for cooled SWIR HgCdTe infrared detector., , , and . NEWCAS, page 1-4. IEEE, (2013)A [10°C; 70°C] 640×480 17µm pixel pitch TEC-less IR bolometer imager with below 50mK and below 4V power supply., , , , , , and . ISSCC, page 394-395. IEEE, (2013)An 88dB SNR, 30µm pixel pitch Infra-Red image sensor with a 2-step 16 bit A/D conversion., , , , , , and . VLSIC, page 128-129. IEEE, (2012)A 533pW NEP 31×31 pixel THz image sensor based on in-pixel demodulation., , , , , , , , , and 1 other author(s). ESSCIRC, page 303-306. IEEE, (2014)A 5500-frames/s 85-GOPS/W 3-D Stacked BSI Vision Chip Based on Parallel In-Focal-Plane Acquisition and Processing., , , , , , , , , and 2 other author(s). J. Solid-State Circuits, 54 (4): 1096-1105 (2019)A 5500FPS 85GOPS/W 3D Stacked BSI Vision Chip Based on Parallel in-Focal-Plane Acquisition and Processing., , , , , , , , , and 2 other author(s). VLSI Circuits, page 245-246. IEEE, (2018)A Scalable Architecture for Multi Millions Frames per Second CMOS Sensor With Digital Storage., , , , , , , , and . NEWCAS, page 252-255. IEEE, (2018)New 3D-integrated burst image sensor architectures with in-situ A/D conversion., , , , and . DASIP, page 215-222. IEEE, (2013)