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Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection.

, , , and . IEEE Trans. Automation Science and Engineering, 13 (2): 757-771 (2016)

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Robust automatic void detection in solder balls., , , and . ICASSP, page 1650-1653. IEEE, (2010)Automated Detection and Classification of Non-Wet Solder Joints., , , and . IEEE Trans. Automation Science and Engineering, 8 (1): 67-80 (2011)Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection., , , and . IEEE Trans. Automation Science and Engineering, 13 (2): 757-771 (2016)