Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Mechanical and thermal properties of Si--C--N material from polyvinylsilazane, , , , and . Journal of materials science, 33 (21): 5237--5241 (1998)Effect of high current pulses on solder interfacial reaction and interconnect reliability, , , and . Microelectronics reliability, 122 (July): 114151 (2021)Ceramic oxidation protection layer of polymer pre-phases, , , and . Binding Plastics and Plastics Binding(Verbundwerkstoffe und Werkstoffverbunde). Deutsche Gesellschaft fur Metallkunde, Adensauerallee 21, Oberursel 1, 6370, Germany, 1996., (1996)Mechanical and thermal properties of polymer-derived Si-CN material, , , , and . Advances in science and technology, (1999)Determining Power Transformers' Sequence of Service in Power Grids, , , and . IEEE Transactions on Dielectrics and Electrical Insulation, 18 (5): 1789-1797 (October 2011)Effiziente Zuteilung knapper Wartungs- und Instandsetzungsresourcen an Leistungstransformatoren, , , , and . (2010)Determining Power Transformers’ Sequence of Maintenance and Repair in Power Grids, , , and . (2010)Hochfrequente Spannungsqualitäts- und Transientenmessungen an Leistungstransformatoren, , , , and . Stuttgarter Hochspannungssymposium 2021 : Neue Technologien für die Netze von morgen, page 138-143. Stuttgart, Institut für Energieübertragung und Hochspannungstechnik, (2021)Void formation in solder joints under power cycling conditions and its effect on reliability, , , , and . 100-101, page 113350. Amsterdam, Elsevier, (2019)Effect of Joule heating on the reliability of solder joints under power cycling conditions, , , , and . 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018), 88/90, page 684-690. Amsterdam, Elsevier, (2018)