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122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications.

, , , , , , and . PIMRC, page 1392-1396. IEEE, (2013)

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A 4-bit SiGe passive phase shifter for X-band phased arrays., , , and . RWS, page 310-312. IEEE, (2013)Ultra-Low Noise Amplifier for X-Band SiGe BiCMOS Phased Array Applications., , , , and . IEEE Trans. on Circuits and Systems, 66-II (9): 1507-1511 (2019)200 mm Wafer level graphene transfer by wafer bonding technique., , , , , , , and . ESSDERC, page 216-219. IEEE, (2017)Estimation of RF performance from LF measurements: Towards the design for reliability in RF-MEMS., , , , , and . Microelectron. Reliab., 52 (9-10): 2310-2313 (2012)Failure analysis and detection methodology for capacitive RF-MEMS switches based on BEOL BiCMOS process., , , , , and . Microelectronics Reliability, 53 (9-11): 1659-1662 (2013)Experiments on MEMS Integration in 0.25 μm CMOS Process., , , , and . Sensors, 18 (7): 2111 (2018)Building blocks for an X-Band SiGe BiCMOS T/R module., , , and . RWS, page 301-303. IEEE, (2013)122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications., , , , , , and . PIMRC, page 1392-1396. IEEE, (2013)High-performance W-band LNA and SPDT switch in 0.13µm SiGe HBT technology., , , , and . RWS, page 162-164. IEEE, (2015)