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Modeling parasitic vertical PNP in HVCMOS., , , and . MIXDES, page 486-489. IEEE, (2015)Modeling Surface Recombination with Enhanced Devices Network for Optoelectronics., , , and . NEWCAS, page 35-39. IEEE, (2018)Modeling avalanche breakdown for ESD diodes in integrated circuits., , , and . DTIS, page 1-3. IEEE, (2015)Spice simulation of passive protection in smart power ICs., , , and . MIXDES, page 500-503. IEEE, (2015)Substrate noise modeling with dedicated CAD framework for smart power ICs., , , , , , and . ISCAS, page 1554-1557. IEEE, (2015)Active guard ring characterization for Smart Power ICs., , , and . MIXDES, page 305-309. IEEE, (2016)Spice simulation of substrate minority carriers propagation with equivalent electrical circuit., , , and . MIXDES, page 347-350. IEEE, (2014)Methodology for 3-D Substrate Network Extraction for SPICE Simulation of Parasitic Currents in Smart Power ICs., , , , , , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 35 (9): 1489-1502 (2016)Analysis of substrate currents propagation in HVCMOS technology., , , , , and . ESSDERC, page 319-322. IEEE, (2016)Optimization strategy of numerical simulations applied to EPFL substrate model., , , and . MIXDES, page 334-337. IEEE, (2014)