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Virtual qualification of moisture induced failures of advanced packages., , , , , , and . Microelectronics Reliability, 47 (2-3): 273-279 (2007)Prediction of Delamination Related IC & Packaging Reliability Problems., , , and . Microelectronics Reliability, 45 (9-11): 1633-1638 (2005)Reliability challenges in the nanoelectronics era., and . Microelectronics Reliability, 46 (9-11): 1403-1414 (2006)Multiscale modelling of multilayer substrates., , , and . Microelectronics Reliability, 46 (9-11): 1472-1477 (2006)The challenges of virtual prototyping and qualification for future microelectronics.. Microelectronics Reliability, 43 (9-11): 1777-1783 (2003)Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP., , , and . Microelectronics Reliability, 48 (8-9): 1167-1170 (2008)Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach., , , , and . Microelectronics Reliability, 44 (12): 1947-1955 (2004)Prediction of crack growth in IC passivation layers., , , , , and . Microelectronics Reliability, 44 (12): 2003-2009 (2004)Prediction of thermo-mechanical integrity of wafer backend processes., , , , , , and . Microelectronics Reliability, 44 (12): 2011-2017 (2004)Carbon Nanotube based heat-sink for solid state lighting., , , , , and . NEMS, page 1214-1217. IEEE, (2013)