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Enhancement of the spatial resolution of near-field immunity maps., and . EMC Compo, page 163-168. IEEE, (2015)Upgrading In-Circuit Test of High Density PCBAs Using Electromagnetic Measurement and Principal Component Analysis., , , and . J. Electronic Testing, 34 (6): 749-762 (2018)Analysis and modeling of passive device degradation for a long-term electromagnetic emission study of a DC-DC converter., , and . Microelectronics Reliability, 55 (9-10): 2061-2066 (2015)Study of the impact of hot carrier injection to immunity of MOSFET to electromagnetic interferences., , , , and . Microelectronics Reliability, 51 (9-11): 1557-1560 (2011)Effect of Aging on Power Integrity and Conducted Emission of Digital Integrated Circuits., and . J. Low Power Electronics, 10 (1): 165-172 (2014)Bandgap failure study due to parasitic bipolar substrate coupling in Smart Power mixed ICs., , and . EMC Compo, page 34-38. IEEE, (2015)EMC performance analysis of a processor/memory system using PCB and Package-On-Package., , , , , and . EMC Compo, page 238-243. IEEE, (2015)Ageing effect on electromagnetic susceptibility of a phase locked loop., , , and . Microelectronics Reliability, 50 (9-11): 1304-1308 (2010)IC Immunity Modeling Process Validation Using On-Chip Measurements., , , and . J. Electronic Testing, 28 (3): 339-348 (2012)Integrated Circuit Emission Model Extraction with a Fuzzy Logic System., , and . IJFSA, 1 (2): 17-28 (2011)