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Disambiguation of "Wang, Zeyi"

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Eliminating accidental deviations to minimize generalization error and maximize replicability: Applications in connectomics and genomics.

, , , , , , , , , , , , , , , and . PLoS Comput. Biol., (2021)

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Zhe Wang University of Stuttgart

Dr. Dongren Wang University of Stuttgart

Dr. rer. nat. Lei Wang University of Stuttgart

Yi Wang University of Stuttgart

Yao Wang University of Stuttgart

 

Other publications of authors with the same name

Improved Boundary Element Method for Fast 3-D Interconnect Resistance Extraction., , , and . IEICE Transactions, 88-C (2): 232-240 (2005)A new boundary element method for accurate modeling of lossy substrates with arbitrary doping profiles., , and . ASP-DAC, page 683-688. IEEE, (2006)A minimum-order boundary element method to extract the 3-D inductance and resistance of the interconnects in VLSI., and . Science in China Series F: Information Sciences, 45 (6): 453-461 (2002)A Mixed Boundary Element Method for Extracting Frequency- Inductances of 3D Interconnects., , and . ISQED, page 709-716. IEEE Computer Society, (2006)Efficient 3-D extraction of interconnect capacitance considering floating metal fills with boundary element method., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 25 (1): 12-18 (2006)A 3-D Minimum-Order Boundary Integral Equation Technique to Extract Frequency-Dependant Inductance and Resistance in ULSI., , and . VLSI Design, page 305-310. IEEE Computer Society, (2002)The Hierarchical h-Adaptive 3-D Boundary Element Computation of VLSI Interconnect Capacitance., , and . ASP-DAC, page 93-. IEEE Computer Society, (1999)A two-dimensional resistance simulator using the boundary element method., and . IEEE Trans. on CAD of Integrated Circuits and Systems, 11 (4): 497-504 (1992)A parallel multipole accelerated 3-D capacitance simulator based on an improved model., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 15 (12): 1441-1450 (1996)An efficient quasi-multiple medium algorithm fo the capacitance extraction of actual 3-D VLSI interconnects., and . ASP-DAC, page 366-372. ACM, (2001)