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Overview of IBM zEnterprise 196 I/O subsystem with focus on new PCI Express infrastructure.

, , , , , , , , , and . IBM Journal of Research and Development, 56 (1): 8 (2012)

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A power, packaging, and cooling overview of the IBM eServer z900., , , , , , , , , and 3 other author(s). IBM Journal of Research and Development, 46 (6): 711-738 (2002)Packaging design of the IBM System z10 Enterprise Class platform central electronic complex., , , , , , , , , and 2 other author(s). IBM Journal of Research and Development, 53 (1): 9 (2009)Mechanical packaging, power, and cooling design for the IBM z13., , , , , , , , , and 3 other author(s). IBM Journal of Research and Development, (2015)Overview of IBM zEnterprise 196 I/O subsystem with focus on new PCI Express infrastructure., , , , , , , , , and . IBM Journal of Research and Development, 56 (1): 8 (2012)Electronic packaging of the IBM System z196 enterprise-class server processor cage., , , , , , , , , and 7 other author(s). IBM Journal of Research and Development, 56 (1): 2 (2012)IBM zEnterprise energy management., , , , , , , , and . IBM Journal of Research and Development, 56 (1): 12 (2012)Packaging the IBM eServer z990 central electronic complex., , , , , and . IBM Journal of Research and Development, 48 (3-4): 395-408 (2004)