Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Si Stencil-Masken für die Herstellung Organischer Dünnschichttransistoren

L. Florian, Z. Tarek, A. Frederik, B. Jörg, R. Harald, K. Hagen, and B. Joachim N.. Proceedings : Mikrosystemtechnik-Kongress 2011 : 10. - 12. Oktober 2011, Darmstadt, page 181-184. Berlin, VDE-Verlag, (2011)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Florian Weiss

PD Dr. -Ing. Florian Bauer University of Stuttgart

Florian Helber University of Stuttgart

Florian Seibold University of Stuttgart

Florian Reichelt University of Stuttgart

Other publications of authors with the same name

High-efficient CMOS-compatible grating couplers with backside metal mirrorW. Sfar Zaoui, M. Berroth, F. Letzkus, and J. Butschke. (2014)Contact Properties of High-Mobility, Air-Stable, Low-Voltage Organic N-Channel TransistorsR. Rödel, F. Letzkus, T. Zaki, J. Burghartz, U. Kraft, U. Zschieschang, K. Kern, and H. Klauk. (2014)Flexible Low-Voltage Organic Complementary Circuits : Finding the Optimum Combination of Semiconductors And Monolayer Gate DielectricsU. Kraft, M. Sejfić, M. Kang, K. Takimiya, T. Zaki, F. Letzkus, J. Burghartz, E. Weber, and H. Klauk. Advanced Materials, 27 (2): 207-214 (January 2014)Self-aligned through silicon vias in ultra-thin chips for 3D-integrationS. Ferwana, C. Harendt, F. Letzkus, and J. Burghartz. 2012 4th Electronic System-Integration Technology Conference, Piscataway, New Jersey, IEEE, (2012)Through-Silicon Via Technology in Chipfilm Substrates For 3D-IntegrationS. Ferwana, C. Harendt, A. Kern, F. Letzkus, and J. Burghartz. page 63-66. (2011)A 3.3V 6b 100kS/s current-steering D/A converter using organic thin-film transistors on glassT. Zaki, F. Ante, U. Zschieschang, J. Butschke, F. Letzkus, H. Richter, H. Klauk, and J. Burghartz. 2011 IEEE International Solid-State Circuits Conference, page 324-325. Piscataway, New Jersey, IEEE, (2011)Low-voltage organic transistors for flexible electronics.U. Zschieschang, R. Rodel, U. Kraft, K. Takimiya, T. Zaki, F. Letzkus, J. Butschke, H. Richter, J. Burghartz, W. Xiong and 2 other author(s). DATE, page 1-6. European Design and Automation Association, (2014)Subwavelength structures for advanced silicon photonic circuitsM. Berroth, T. Föhn, W. Sfar Zaoui, M. Félix Rosa, N. Hoppe, W. Vogel, J. Butschke, F. Letzkus, and M. Kaschel. Optische Komponenten für Cloud-Datacenter : XII. ITG-Workshop, Fachgruppe 5.3.2, ITG, Photonische Komponenten und Mikrosysteme, page 25-26. Göttingen, Cuvillier Verlag, (2015)Bridging the gap between optical fibers and silicon photonic integrated circuitsW. Sfar Zaoui, A. Kunze, W. Vogel, M. Berroth, J. Butschke, F. Letzkus, and J. Burghartz. Optics express, 22 (2): 1277--1286 (2014)Stencil Lithography For Organic Thin-Film Transistors With A Channel Length Of 300 NmU. Zschieschang, J. Borchert, M. Geiger, F. Letzkus, J. Burghartz, and H. Klauk. Organic Electronics, (October 2018)