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Disambiguation of "Yu, Hao"

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An energy-efficient 2.5D through-silicon interposer I/O with self-adaptive adjustment of output-voltage swing.

, , , , and . ISLPED, page 93-98. ACM, (2014)

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Wei Yu University of Stuttgart

Xiang Hao University of Stuttgart

Hao Lu University of Stuttgart

Yiwen Yuan University of Stuttgart

Xingyao Yu University of Stuttgart

 

Other publications of authors with the same name

Design of a Weighted-Rotor Energy Harvester Based on Dynamic Analysis and Optimization of Circular Halbach Array Magnetic Disk., , and . Micromachines, 6 (3): 375-389 (2015)A Single-Frame Superresolution Algorithm for Lab-on-a-Chip Lensless Microfluidic Imaging., , , , and . IEEE Design & Test, 32 (6): 32-40 (2015)Variability-Aware Parametric Yield Estimation for Analog/Mixed-Signal Circuits: Concepts, Algorithms, and Challenges., , , and . IEEE Design & Test, 31 (4): 6-15 (2014)Design and Analysis of CMOS-Based Terahertz Integrated Circuits by Causal Fractional-Order RLGC Transmission Line Model., , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 3 (3): 355-366 (2013)Multi-Level Round-Robin Multicast Scheduling with Look-Ahead Mechanism., , and . ICC, page 1-5. IEEE, (2011)3D reconfigurable power switch network for demand-supply matching between multi-output power converters and many-core microprocessors., , , and . DATE, page 1643-1648. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects., , , , and . ASP-DAC, page 485-490. IEEE, (2013)Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model., , , , , and . ASP-DAC, page 693-698. IEEE, (2013)Staggered Twisted-Bundle Interconnect for Crosstalk and Delay Reduction., and . ISQED, page 682-687. IEEE Computer Society, (2005)A 96×96 1V ultra-low power CMOS image sensor for biomedical application., , , , , , and . APCCAS, page 13-16. IEEE, (2012)