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Signal modulation schemes comparison in the telemetry unit for retinal prosthesis system.

, , , and . NEMS, page 632-636. IEEE Computer Society, (2009)

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A Novel Wafer-Level Packaging Solution For Mems., , , , , and . International Journal of Computational Engineering Science, 4 (2): 339-342 (2003)Research on the structure of ultrathin Si PIN detector., , , , and . NEMS, page 629-632. IEEE, (2013)Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration., , , , , , and . NEMS, page 90-93. IEEE Computer Society, (2009)Towards HMM based human motion recognition using MEMS inertial sensors., , , , and . ROBIO, page 1762-1766. IEEE, (2008)Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding., , , and . International Journal of Computational Engineering Science, 4 (2): 335-338 (2003)PCA/ICA-based SVM for fall recognition using MEMS motion sensing data., , , and . APCCAS, page 69-72. IEEE, (2008)Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure., , , , , , , , and . NEMS, page 514-519. IEEE, (2019)Electrical characterization of integrated passive devices using thin film technology for 3D integration., , , , , , , and . Journal of Zhejiang University - Science C, 14 (4): 235-243 (2013)A 3D micro-channel cooling system embedded in LTCC packaging substrate., , , , , and . NEMS, page 649-652. IEEE, (2012)Fabrication and characterization of ultra-thin PIN detector., , , , , and . NEMS, page 513-517. IEEE, (2010)