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%0 Journal Article
%1 journals/ibmrd/AndryTWSWDM08
%A Andry, Paul S.
%A Tsang, Cornelia K.
%A Webb, Bucknell C.
%A Sprogis, Edmund J.
%A Wright, Steven L.
%A Dang, Bing
%A Manzer, Dennis G.
%D 2008
%J IBM Journal of Research and Development
%K dblp
%N 6
%P 571-581
%T Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
%U http://dblp.uni-trier.de/db/journals/ibmrd/ibmrd52.html#AndryTWSWDM08
%V 52
@article{journals/ibmrd/AndryTWSWDM08,
added-at = {2011-03-23T00:00:00.000+0100},
author = {Andry, Paul S. and Tsang, Cornelia K. and Webb, Bucknell C. and Sprogis, Edmund J. and Wright, Steven L. and Dang, Bing and Manzer, Dennis G.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2dbc19699c8e6b0f15dce7fee38737b25/dblp},
ee = {http://dx.doi.org/10.1147/JRD.2008.5388558},
interhash = {ef4be3af083ea0b32aca599289782b16},
intrahash = {dbc19699c8e6b0f15dce7fee38737b25},
journal = {IBM Journal of Research and Development},
keywords = {dblp},
number = 6,
pages = {571-581},
timestamp = {2016-02-02T08:59:06.000+0100},
title = {Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.},
url = {http://dblp.uni-trier.de/db/journals/ibmrd/ibmrd52.html#AndryTWSWDM08},
volume = 52,
year = 2008
}
