%0 Journal Article %1 dey2021millimeterwave %A Dey, Utpal %A Hesselbarth, Jan %D 2021 %I IEEE %J IEEE transactions on components, packaging and manufacturing technology %K %N 3 %P 493-503 %R 10.1109/TCPMT.2020.3048155 %T Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances %V 11

@article{dey2021millimeterwave, added-at = {2023-08-31T16:26:24.000+0200}, affiliation = {Dey, U (Corresponding Author), Univ Stuttgart, Inst Radio Frequency Technol IHF, D-70569 Stuttgart, Germany. Dey, Utpal; Hesselbarth, Jan, Univ Stuttgart, Inst Radio Frequency Technol IHF, D-70569 Stuttgart, Germany.}, author = {Dey, Utpal and Hesselbarth, Jan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2302ae096ef182122c9febf751eb80a5b/puma-wartung}, doi = {10.1109/TCPMT.2020.3048155}, interhash = {ec33e6b46426ed77fcc062682b7399e8}, intrahash = {302ae096ef182122c9febf751eb80a5b}, issn = {{2156-3950} and {2156-3985}}, journal = {IEEE transactions on components, packaging and manufacturing technology}, keywords = {}, language = {eng}, number = 3, pages = {493-503}, publisher = {IEEE}, research-areas = {Engineering; Materials Science}, timestamp = {2023-08-31T14:26:24.000+0200}, title = {Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances}, unique-id = {ISI:000633636700014}, volume = 11, year = 2021 }