%0 Conference Paper %1 conf/dac/JungSWPL14 %A Jung, Moongon %A Song, Taigon %A Wan, Yang %A Peng, Yarui %A Lim, Sung Kyu %B DAC %D 2014 %I ACM %K dblp %P 4:1-4:6 %T On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. %U http://dblp.uni-trier.de/db/conf/dac/dac2014.html#JungSWPL14 %@ 978-1-4503-2730-5

@inproceedings{conf/dac/JungSWPL14, added-at = {2018-11-06T00:00:00.000+0100}, author = {Jung, Moongon and Song, Taigon and Wan, Yang and Peng, Yarui and Lim, Sung Kyu}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2b211ff7dd5843340767e59b159f8b4c3/dblp}, booktitle = {DAC}, crossref = {conf/dac/2014}, ee = {https://doi.org/10.1145/2593069.2593167}, interhash = {e1310ac6ffd2834d883b88754c4bd384}, intrahash = {b211ff7dd5843340767e59b159f8b4c3}, isbn = {978-1-4503-2730-5}, keywords = {dblp}, pages = {4:1-4:6}, publisher = {ACM}, timestamp = {2019-09-27T20:19:33.000+0200}, title = {On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective.}, url = {http://dblp.uni-trier.de/db/conf/dac/dac2014.html#JungSWPL14}, year = 2014 }