%0 Journal Article %1 journals/mr/LiSTSBZ05 %A Li, H. Y. %A Su, Y. J. %A Tsang, C. F. %A Sohan, S. M. %A Bliznetsov, V. N. %A Zhang, L. %D 2005 %J Microelectronics Reliability %K dblp %N 7-8 %P 1134-1143 %T Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. %U http://dblp.uni-trier.de/db/journals/mr/mr45.html#LiSTSBZ05 %V 45

@article{journals/mr/LiSTSBZ05, added-at = {2007-11-15T00:00:00.000+0100}, author = {Li, H. Y. and Su, Y. J. and Tsang, C. F. and Sohan, S. M. and Bliznetsov, V. N. and Zhang, L.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2d6e79aafb5d068b59979121c42b8c81c/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2004.11.057}, interhash = {7f5ed31705f42e37f8f72507dd31da72}, intrahash = {d6e79aafb5d068b59979121c42b8c81c}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = {7-8}, pages = {1134-1143}, timestamp = {2016-02-02T02:00:42.000+0100}, title = {Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr45.html#LiSTSBZ05}, volume = 45, year = 2005 }