%0 Journal Article %1 wild2018effect %A Wild, P. %A Lorenz, D. %A Groezinger, T. %A Zimmermann, André %D 2018 %I Elsevier %J Microelectronics Reliability %K %P 163-175 %R 10.1016/j.microrel.2018.04.014 %T Effect of voids on thermo-mechanical reliability of chip resistor solder joints : Experiment, modelling and simulation %V 85

@article{wild2018effect, added-at = {2023-08-31T16:43:59.000+0200}, affiliation = {Wild, P (Reprint Author), Rehm Thermal Syst, Blaubeuren Seissen, Germany. Wild, P., Rehm Thermal Syst, Blaubeuren Seissen, Germany. Groezinger, T.; Zimmermann, A., Hahn Schickard, Stuttgart, Germany. Lorenz, D., Festo AG, Esslingen, Germany. Zimmermann, A., Univ Stuttgart, IFM, Stuttgart, Germany.}, author = {Wild, P. and Lorenz, D. and Groezinger, T. and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2e54437e4afdfbffac5e014c46316074f/puma-wartung}, doi = {10.1016/j.microrel.2018.04.014}, interhash = {71c95dfeda24114bdc823f94ef6ef769}, intrahash = {e54437e4afdfbffac5e014c46316074f}, issn = {0026-2714}, journal = {Microelectronics Reliability}, keywords = {}, language = {eng}, orcid-numbers = {Groezinger, Tobias/0000-0002-1826-3592}, pages = {163-175}, publisher = {Elsevier}, research-areas = {Engineering; Science & Technology - Other Topics; Physics}, timestamp = {2023-08-31T14:43:59.000+0200}, title = {Effect of voids on thermo-mechanical reliability of chip resistor solder joints : Experiment, modelling and simulation}, unique-id = {ISI:000436888200018}, volume = 85, year = 2018 }