%0 Conference Paper %1 dey2018millimeterwave %A Dey, Utpal %A Hesselbarth, Jan %B 2018 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM - IMS %D 2018 %I IEEE %K chip-to-chip dielectric flexible interconnect millimeter resonator waveguide waves %P 1549-1552 %R 10.1109/MWSYM.2018.8439683 %T Millimeter-wave Chip-to-Chip Interconnect Using Plastic Wire Operating in Single and Dual Mode %U https://ieeexplore.ieee.org/document/8439683 %@ 978-1-5386-5067-7

@inproceedings{dey2018millimeterwave, added-at = {2020-03-19T19:29:54.000+0100}, affiliation = {Dey, U (Reprint Author), Univ Stuttgart, Inst Radio Frequency Technol, Stuttgart, Germany. Dey, Utpal; Hesselbarth, Jan, Univ Stuttgart, Inst Radio Frequency Technol, Stuttgart, Germany.}, author = {Dey, Utpal and Hesselbarth, Jan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2555749065b3ab126e0e47ffaa3a98bce/yvesm}, book-group-author = {IEEE}, booktitle = {2018 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM - IMS}, da = {2019-03-21}, doi = {10.1109/MWSYM.2018.8439683}, eissn = {2576-7216}, interhash = {1f238e683dd6c711ec01a5b891e6683a}, intrahash = {555749065b3ab126e0e47ffaa3a98bce}, isbn = {978-1-5386-5067-7}, issn = {0149-645X}, keywords = {chip-to-chip dielectric flexible interconnect millimeter resonator waveguide waves}, language = {English}, note = {IEEE/MTT-S International Microwave Symposium, Philadelphia, PA, JUN 10-15, 2018}, orcid-numbers = {Hesselbarth, Jan/0000-0002-4905-8591}, organization = {IEEE; MTT-S; RFIC; ARFTG; IMBIoC; IMS}, pages = {1549-1552}, publisher = {IEEE}, research-areas = {Engineering}, series = {IEEE MTT-S International Microwave Symposium}, timestamp = {2020-03-19T18:29:54.000+0100}, title = {Millimeter-wave Chip-to-Chip Interconnect Using Plastic Wire Operating in Single and Dual Mode}, type = {Proceedings Paper}, unique-id = {ISI:000451173600409}, url = {https://ieeexplore.ieee.org/document/8439683}, year = 2018 }