%0 Conference Paper %1 dey2018millimeterwave %A Dey, Utpal %A Hesselbarth, Jan %B Proceedings of the 2018 IEEE MTT-S International Microwave Symposium %C Piscataway, NJ %D 2018 %I IEEE %K %P 1549-1552 %R 10.1109/MWSYM.2018.8439683 %T Millimeter-wave Chip-to-Chip Interconnect Using Plastic Wire Operating in Single and Dual Mode %@ 978-1-5386-5067-7

@inproceedings{dey2018millimeterwave, added-at = {2023-08-31T16:26:25.000+0200}, address = {Piscataway, NJ}, affiliation = {Dey, U (Reprint Author), Univ Stuttgart, Inst Radio Frequency Technol, Stuttgart, Germany. Dey, Utpal; Hesselbarth, Jan, Univ Stuttgart, Inst Radio Frequency Technol, Stuttgart, Germany.}, author = {Dey, Utpal and Hesselbarth, Jan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21ac2d3b53b762c6a2136489c68f27b5a/puma-wartung}, booktitle = {Proceedings of the 2018 IEEE MTT-S International Microwave Symposium}, doi = {10.1109/MWSYM.2018.8439683}, eventdate = {2018-06-10/2018-06-15}, eventtitle = {IEEE/MTT-S International Microwave Symposium}, interhash = {1f238e683dd6c711ec01a5b891e6683a}, intrahash = {1ac2d3b53b762c6a2136489c68f27b5a}, isbn = {978-1-5386-5067-7}, keywords = {}, language = {eng}, orcid-numbers = {Hesselbarth, Jan/0000-0002-4905-8591}, pages = {1549-1552}, publisher = {IEEE}, research-areas = {Engineering}, timestamp = {2023-08-31T14:26:25.000+0200}, title = {Millimeter-wave Chip-to-Chip Interconnect Using Plastic Wire Operating in Single and Dual Mode}, unique-id = {ISI:000451173600409}, venue = {Philadelphia, PA}, year = 2018 }