Inproceedings,

A new Method of Fluidic-Based Assembly with Surface Tension

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Micro-Assembly Technologies and Applications, 260, Boston, MA, Springer US, (2008)
DOI: 10.1007/978-0-387-77405-3

Abstract

In the future the assembly technology of smallest chips will get more and more important. The diameter of these chips will be less than 500 µm x 500 µm and about 50 - 70 ?m thick. The conventional manufacturing methods used now reaches the limit in case of the accuracy of position, throughput and the handling of chips. A new concept FLUIDASSEM was raised up to overcome these problems. It is well known that in the micro cosmos surface forces prevail again volume forces. So surface forces are high enough to move and to fix microchips in assembly processes. This paper will show the mechanisms for moving chips by fluids into correct position. Therefore the surface of the substrate must be structured with hydrophilic and hydrophobic structures. Additional micro- and nanostructures have to be added to get super hydrophobic structures. This allows together with the surface tension of the liquid an automated movement of microchips, dispensed on the surface, into a correct position. This paper shows the mechanism in detail. One of the most important part in this new assembly method is the structuring of the surfaces. Hydrophilic areas are used to lead the fluids in the correct position and to start the assembly process. On the other hand during the assembly process some hydrophobic barriers must be passed. In these areas the pinning effect of the fluid should be as small as possible. The paper shows methods to reduce this pinning effect without changing the needed contact angle. One possibility to reduce the pinning effect is the above mentioned properly structured surface with nano- and microstructures. Another important part is the idea to replace the pick and place process for the microchips by fluidic systems. The mechanism for manufacturing and first experimental results are also presented in the paper. In addition theoretical approaches and models which allows this new manufacturing method will also be described in detail. Results of simulation models are presented and compared with first experimental results. Due to the big range of scaling, from less than 1 nm up to 10?m, a new approach for simulation using continuum mechanics was set up (see also figure 1 and 2). The simulation leads to the result how the micro- and nanostructuring of the surfaces has to be arranged.

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