Inproceedings,

On-Chip Isolation in Wafer-Level Chip-Scale Packages : Substrate Thinning And Circuit Partitioning by Trenches

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Proceedings : November 18 - 20, 2003, Hynes Convention Center, Boston, MA : November 18 - 20, 2003, Hynes Convention Center, Boston, MA, Washington D.C., IMAPS, (2003)

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