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%0 Journal Article
%1 journals/mr/TanYSSW15
%A Tan, Y. Y.
%A Yang, Q. L.
%A Sim, K. S.
%A Sun, Li Tao
%A Wu, Xing
%D 2015
%J Microelectronics Reliability
%K dblp
%N 11
%P 2316-2323
%T Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing.
%U http://dblp.uni-trier.de/db/journals/mr/mr55.html#TanYSSW15
%V 55
@article{journals/mr/TanYSSW15,
added-at = {2018-11-14T00:00:00.000+0100},
author = {Tan, Y. Y. and Yang, Q. L. and Sim, K. S. and Sun, Li Tao and Wu, Xing},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2b89c6147ad97b7ad47140c8aba3628ec/dblp},
ee = {https://www.wikidata.org/entity/Q56918807},
interhash = {e3140fc56cb9b8aee6ca43e161927973},
intrahash = {b89c6147ad97b7ad47140c8aba3628ec},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = 11,
pages = {2316-2323},
timestamp = {2019-09-27T10:58:13.000+0200},
title = {Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#TanYSSW15},
volume = 55,
year = 2015
}
