%0 Conference Paper %1 j-ltwlporuscp2006 %A Tian, J. %A Bartek, Marian %A Iannacci, Jacopo %A Burghartz, Joachim N. %A Sosin, Sebastian %B 2nd International Workshop on Wafer Bonding for MEMS Technologies 2006 : 9th-11th April 2006, Halle/Saale %D 2006 %E Bagdahn, Jörg %K INES firstnamemissing nomoreinformation %T Low Temperature Wafer Level Packaging Of RF-MEMS Using SU-8 Contact Printing

@inproceedings{j-ltwlporuscp2006, added-at = {2019-03-19T18:25:55.000+0100}, author = {Tian, J. and Bartek, Marian and Iannacci, Jacopo and Burghartz, Joachim N. and Sosin, Sebastian}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2827bd18a7030f2926a539b44f2185ba7/kevin.konnerth}, booktitle = {2nd International Workshop on Wafer Bonding for MEMS Technologies 2006 : 9th-11th April 2006, Halle/Saale}, editor = {Bagdahn, Jörg}, eventdate = {2006-04-09/2006-04-11}, eventtitle = {2nd International Workshop on Wafer Bonding for MEMS Technologies}, interhash = {b5611a672df3f3c03e68432daefac528}, intrahash = {827bd18a7030f2926a539b44f2185ba7}, keywords = {INES firstnamemissing nomoreinformation}, timestamp = {2019-03-19T17:25:55.000+0100}, title = {Low Temperature Wafer Level Packaging Of RF-MEMS Using SU-8 Contact Printing}, venue = {Halle, Germany}, year = 2006 }