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Low Temperature Wafer Level Packaging Of RF-MEMS Using SU-8 Contact Printing

, , , , and . 2nd International Workshop on Wafer Bonding for MEMS Technologies 2006 : 9th-11th April 2006, Halle/Saale, (2006)

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PACD Process Development : October 2002, , , , , , , , , and 1 other author(s). (2002)Low Temperature Wafer Level Packaging Of RF-MEMS Using SU-8 Contact Printing, , , , and . 2nd International Workshop on Wafer Bonding for MEMS Technologies 2006 : 9th-11th April 2006, Halle/Saale, (2006)An Integrated Folded-Patch Antenna for Wireless Microsystems, , , , and . SENSORS, 2004 IEEE, page 485-488. Piscataway, New Jersey, IEEE, (2004)Folded-Patch Chip-Size Antennas for Wireless Microsystems, , , , and . Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands, page 748-752. Utrecht, Technology Foundation, (2003)Extraction of Glass-Wafers Electrical Properties Based on S-Parameters Measurements of Coplanar Waveguides, , , , and . Proceedings of the 4th conference on the telecommunications, page 51-54. Aveiro, Instituto de Telecomunicações, (2003)Wafer-Level Chip-Scale Packaging for RF Applications, , and . 2002 proceedings : SAFE-ProRISC-SeSens, November 27 - 29, 2002, Veldhoven, the Netherlands, page 87-90. (2002)Modeling and Analysis of Substrate Coupling in Silicon Integrated Circuits, , and . 2002 proceedings : SAFE-ProRISC-SeSens, November 27 - 29, 2002, Veldhoven, the Netherlands, page 704-707. (2002)Mechanical Reliability of Micromachined Silicon Wafers with Deep Rectangular Recesses and Via-Hole Fences, , and . Book of abstracts : Eurosensors XVI, The 16th European Conference on Solid-State Transducers, September 15 - 18, 2002, Prague, Czech Republic, page 255-256. Prag, Czech Technical University, (2002)Substrate options and add-on process modules for monolithic RF silicon technology, , , , , , , and . Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, page 17-23. Piscataway, New Jersey, IEEE, (2002)Size reduction and tuning of integrated folded patch antennas using slots, , , and . 34th European Microwave Conference, 2004, page 1337-1340. Piscataway, New Jersey, IEEE, (2004)