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%0 Conference Paper
%1 conf/iccad/PathakPPL11
%A Pathak, Mohit
%A Pak, Jiwoo
%A Pan, David Z.
%A Lim, Sung Kyu
%B ICCAD
%D 2011
%E Phillips, Joel R.
%E Hu, Alan J.
%E Graeb, Helmut
%I IEEE Computer Society
%K dblp
%P 555-562
%T Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs.
%U http://dblp.uni-trier.de/db/conf/iccad/iccad2011.html#PathakPPL11
%@ 978-1-4577-1399-6
@inproceedings{conf/iccad/PathakPPL11,
added-at = {2015-05-01T00:00:00.000+0200},
author = {Pathak, Mohit and Pak, Jiwoo and Pan, David Z. and Lim, Sung Kyu},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/237f93523016dd5665e24a098805aab64/dblp},
booktitle = {ICCAD},
crossref = {conf/iccad/2011},
editor = {Phillips, Joel R. and Hu, Alan J. and Graeb, Helmut},
ee = {http://dl.acm.org/citation.cfm?id=2132454},
interhash = {8b61aa7a2338b09d1dc8acaf42063768},
intrahash = {37f93523016dd5665e24a098805aab64},
isbn = {978-1-4577-1399-6},
keywords = {dblp},
pages = {555-562},
publisher = {IEEE Computer Society},
timestamp = {2016-02-02T13:49:16.000+0100},
title = {Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs.},
url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2011.html#PathakPPL11},
year = 2011
}
