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%0 Journal Article
%1 journals/mr/BornBBDGHKLV09
%A Born, V.
%A Beck, M.
%A Bosholm, O.
%A Dalleau, D.
%A Glenz, S.
%A Haverkamp, I.
%A Kurz, G.
%A Lange, F.
%A Vest, A.
%D 2009
%J Microelectronics Reliability
%K dblp
%N 1
%P 74-78
%T Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity.
%U http://dblp.uni-trier.de/db/journals/mr/mr49.html#BornBBDGHKLV09
%V 49
@article{journals/mr/BornBBDGHKLV09,
added-at = {2010-09-28T00:00:00.000+0200},
author = {Born, V. and Beck, M. and Bosholm, O. and Dalleau, D. and Glenz, S. and Haverkamp, I. and Kurz, G. and Lange, F. and Vest, A.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/260ef8334e8dcf3da7a306dc5f65e858b/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2008.10.017},
interhash = {62b53757e7deaa0763142e41fa0459d4},
intrahash = {60ef8334e8dcf3da7a306dc5f65e858b},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = 1,
pages = {74-78},
timestamp = {2016-02-02T01:59:36.000+0100},
title = {Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#BornBBDGHKLV09},
volume = 49,
year = 2009
}