%0 Journal Article %1 journals/mr/BornBBDGHKLV09 %A Born, V. %A Beck, M. %A Bosholm, O. %A Dalleau, D. %A Glenz, S. %A Haverkamp, I. %A Kurz, G. %A Lange, F. %A Vest, A. %D 2009 %J Microelectronics Reliability %K dblp %N 1 %P 74-78 %T Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. %U http://dblp.uni-trier.de/db/journals/mr/mr49.html#BornBBDGHKLV09 %V 49

@article{journals/mr/BornBBDGHKLV09, added-at = {2010-09-28T00:00:00.000+0200}, author = {Born, V. and Beck, M. and Bosholm, O. and Dalleau, D. and Glenz, S. and Haverkamp, I. and Kurz, G. and Lange, F. and Vest, A.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/260ef8334e8dcf3da7a306dc5f65e858b/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2008.10.017}, interhash = {62b53757e7deaa0763142e41fa0459d4}, intrahash = {60ef8334e8dcf3da7a306dc5f65e858b}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {74-78}, timestamp = {2016-02-02T01:59:36.000+0100}, title = {Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#BornBBDGHKLV09}, volume = 49, year = 2009 }