Inproceedings,

Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

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Transducers '01 Eurosensors XV : digest of technical papers, 1, page 210-213. Berlin, Springer, (2001)
DOI: 10.1007/978-3-642-59497-7_49

Abstract

An assembly technology that has received little attention up to now in the area of microsensors is anisotropic conductive sticking, which is already state-of-the-art in the bonding of LCD displays. This procedure was investigated for a microsensors' application and used for a low pressure sensor as a practical example. In addition to an improvement in the tolerance to ambient media, the temperature-dependent offset drift could be reduced by a factor of about 10.

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