%0 Conference Paper %1 conf/fpl/AngermeierZGT11 %A Angermeier, Josef %A Ziener, Daniel %A Glaß, Michael %A Teich, Jürgen %B FPL %D 2011 %I IEEE Computer Society %K dblp %P 277-281 %T Stress-Aware Module Placement on Reconfigurable Devices. %U http://dblp.uni-trier.de/db/conf/fpl/fpl2011.html#AngermeierZGT11 %@ 978-1-4577-1484-9

@inproceedings{conf/fpl/AngermeierZGT11, added-at = {2016-04-26T00:00:00.000+0200}, author = {Angermeier, Josef and Ziener, Daniel and Glaß, Michael and Teich, Jürgen}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/221a9b6a47e9275ca2a409718a81e8181/dblp}, booktitle = {FPL}, crossref = {conf/fpl/2011}, ee = {http://doi.ieeecomputersociety.org/10.1109/FPL.2011.56}, interhash = {4dcf6a6e3b112384f8bae629802e3238}, intrahash = {21a9b6a47e9275ca2a409718a81e8181}, isbn = {978-1-4577-1484-9}, keywords = {dblp}, pages = {277-281}, publisher = {IEEE Computer Society}, timestamp = {2016-04-27T09:32:54.000+0200}, title = {Stress-Aware Module Placement on Reconfigurable Devices.}, url = {http://dblp.uni-trier.de/db/conf/fpl/fpl2011.html#AngermeierZGT11}, year = 2011 }