%0 Journal Article %1 journals/mr/WildLGZ18 %A Wild, Paul %A Lorenz, Dominik %A Grözinger, Tobias %A Zimmermann, André %D 2018 %J Microelectronics Reliability %K dblp %P 163-175 %T Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. %U http://dblp.uni-trier.de/db/journals/mr/mr85.html#WildLGZ18 %V 85

@article{journals/mr/WildLGZ18, added-at = {2019-01-22T00:00:00.000+0100}, author = {Wild, Paul and Lorenz, Dominik and Grözinger, Tobias and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2d397b031efcb555e1de29ed7f4dc4dc7/dblp}, ee = {https://doi.org/10.1016/j.microrel.2018.04.014}, interhash = {359014aefd51e1b5d39b0a1562daa7c6}, intrahash = {d397b031efcb555e1de29ed7f4dc4dc7}, journal = {Microelectronics Reliability}, keywords = {dblp}, pages = {163-175}, timestamp = {2019-09-27T10:58:15.000+0200}, title = {Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr85.html#WildLGZ18}, volume = 85, year = 2018 }