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%0 Conference Paper
%1 conf/iccad/AthikulwongseCYPL10
%A Athikulwongse, Krit
%A Chakraborty, Ashutosh
%A Yang, Jae-Seok
%A Pan, David Z.
%A Lim, Sung Kyu
%B ICCAD
%D 2010
%E Scheffer, Louis
%E Phillips, Joel R.
%E Hu, Alan J.
%I IEEE
%K dblp
%P 669-674
%T Stress-driven 3D-IC placement with TSV keep-out zone and regularity study.
%U http://dblp.uni-trier.de/db/conf/iccad/iccad2010.html#AthikulwongseCYPL10
%@ 978-1-4244-8192-7
@inproceedings{conf/iccad/AthikulwongseCYPL10,
added-at = {2019-02-11T00:00:00.000+0100},
author = {Athikulwongse, Krit and Chakraborty, Ashutosh and Yang, Jae-Seok and Pan, David Z. and Lim, Sung Kyu},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2c32f29377b16b5533480dabc73a2d6a2/dblp},
booktitle = {ICCAD},
crossref = {conf/iccad/2010},
editor = {Scheffer, Louis and Phillips, Joel R. and Hu, Alan J.},
ee = {http://dl.acm.org/citation.cfm?id=2133571},
interhash = {1ff8f3d2d5a499416bad1a512f6ece1e},
intrahash = {c32f29377b16b5533480dabc73a2d6a2},
isbn = {978-1-4244-8192-7},
keywords = {dblp},
pages = {669-674},
publisher = {IEEE},
timestamp = {2019-09-27T20:30:46.000+0200},
title = {Stress-driven 3D-IC placement with TSV keep-out zone and regularity study.},
url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2010.html#AthikulwongseCYPL10},
year = 2010
}
