%0 Journal Article %1 stein2015microstructural %A Stein, J. %A Tineo, Carlos A. Cordova %A Welzel, U. %A Huegel, W. %A Mittemeijer, Eric Jan %D 2015 %I Springer %J Journal of electronic materials %K %N 3 %P 886-894 %R 10.1007/s11664-014-3571-x %T Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates %V 44

@article{stein2015microstructural, added-at = {2023-08-31T16:26:53.000+0200}, affiliation = {Stein, J (Reprint Author), Max Planck Inst Intelligent Syst, Heisenbergstr 3, D-70569 Stuttgart, Germany. Stein, J.; Welzel, U.; Mittemeijer, E. J., Max Planck Inst Intelligent Syst, D-70569 Stuttgart, Germany. Stein, J.; Huegel, W., Robert Bosch GmbH, Automot Elect Engn Assembly Interconnect Technol, D-71701 Schwieberdingen, Germany. Tineo, C. A. Cordova; Mittemeijer, E. J., Univ Stuttgart, Inst Mat Sci, D-70569 Stuttgart, Germany.}, author = {Stein, J. and Tineo, Carlos A. Cordova and Welzel, U. and Huegel, W. and Mittemeijer, Eric Jan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2b20dc8b68e005982a9fb6c5442b70c04/puma-wartung}, doi = {10.1007/s11664-014-3571-x}, interhash = {1e940b36c70144d7380c0378e490a66e}, intrahash = {b20dc8b68e005982a9fb6c5442b70c04}, issn = {{1543-186X} and {0361-5235}}, journal = {Journal of electronic materials}, keywords = {}, language = {eng}, number = 3, pages = {886-894}, publisher = {Springer}, research-areas = {Engineering; Materials Science; Physics}, timestamp = {2023-08-31T14:26:53.000+0200}, title = {Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates}, unique-id = {ISI:000349442100014}, volume = 44, year = 2015 }