%0 Conference Paper %1 conf/slip/KimKL11 %A Kim, Daehyun %A Kim, Suyoun %A Lim, Sung Kyu %B SLIP %D 2011 %E Wang, Janet Meiling %E Chen, Deming %I IEEE %K dblp %P 1-8 %T Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs. %U http://dblp.uni-trier.de/db/conf/slip/slip2011.html#KimKL11 %@ 978-1-4577-1240-1

@inproceedings{conf/slip/KimKL11, added-at = {2012-01-25T00:00:00.000+0100}, author = {Kim, Daehyun and Kim, Suyoun and Lim, Sung Kyu}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2a93582e96e888db02d5dbaf4347cfed9/dblp}, booktitle = {SLIP}, crossref = {conf/slip/2011}, editor = {Wang, Janet Meiling and Chen, Deming}, ee = {http://dx.doi.org/10.1109/SLIP.2011.6135435}, interhash = {0f0a162f72f17cc3064d1a4f39b44fc6}, intrahash = {a93582e96e888db02d5dbaf4347cfed9}, isbn = {978-1-4577-1240-1}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2016-02-02T16:20:00.000+0100}, title = {Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs.}, url = {http://dblp.uni-trier.de/db/conf/slip/slip2011.html#KimKL11}, year = 2011 }