%0 Journal Article %1 journals/tvlsi/LeeC09 %A Lee, Ren-Jie %A Chen, Hung-Ming %D 2009 %J IEEE Trans. VLSI Syst. %K dblp %N 8 %P 1087-1098 %T Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign. %U http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi17.html#LeeC09 %V 17

@article{journals/tvlsi/LeeC09, added-at = {2010-11-16T00:00:00.000+0100}, author = {Lee, Ren-Jie and Chen, Hung-Ming}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2cf92919311c24aedca5c260221dbb5cf/dblp}, ee = {http://dx.doi.org/10.1109/TVLSI.2009.2017795}, interhash = {07abf7168217d0d63801a64c549cef09}, intrahash = {cf92919311c24aedca5c260221dbb5cf}, journal = {IEEE Trans. VLSI Syst.}, keywords = {dblp}, number = 8, pages = {1087-1098}, timestamp = {2016-02-02T02:13:52.000+0100}, title = {Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign.}, url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi17.html#LeeC09}, volume = 17, year = 2009 }